From the category archives:

dummy components

Practical Components helps diagnose and treat Head-in-Pillow failure

6 June 2012 dummy components

Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4×4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP [...]

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Dummy components display case brings training and presentations to life

16 May 2012 dummy components

Practical Components, our partner in the supply of dummy components, has introduced a display case containing a sampling of components. The display case includes components ranging from the latest in high technology (01005s, PoPs, CVBGAs and flip chips) to standard SMT packages (PBGAs, MLFs, QFPs and TSOPs). The display case is equivalent to a CD [...]

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2011 Practical Components catalogue now available

19 August 2011 dummy components

The new Practical Components Catalogue is now available. Practical are reknown for having the best range of dummy electronic components and mechanical samples – ideal for process testing, training and equipment trials. The catalogue is designed to help to you quickly find the products needed to improve or define your technology and your processes. The [...]

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Practical Components’ TMV PoP to be featured on Live Assembly Line at NEW 2011

5 April 2011 dummy components

Practical Components announces that its dummy components have been invited to be part of the Future Proof Assembly Line at the upcoming National Electronics Week exhibition, which is scheduled to take place April 12-13, 2011 at NEC Birmingham. Practical Components will supply the new Amkor TMV PoP (Package on Package) dummy component to the Future [...]

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Package on Package (POP) dummy components

1 February 2011 dummy components

PoP (Package on Package) components are designed for products such as phones, digital cameras and other mobile applications benefiting from the combination of stacked packages and small footprint technology. This innovative component is the next step in 3-D package stacking density and everyone who wants to grow their assembly capability and qualify their process needs [...]

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PC016 Soldering Kit conforms to J-STD-001D specifications

21 January 2010 dummy components

The Practical Components PC016 Mixed Technology Kit is an effective and economical way to train and evaluate students and employees. This kit contains a variety of standard surface mount and through-hole components with tracks to simulate real world situations. Each kit comes individually boxed with all components bagged and labeled for easy identification. It conforms [...]

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