5 April 2011
dummy components
Practical Components announces that its dummy components have been invited to be part of the Future Proof Assembly Line at the upcoming National Electronics Week exhibition, which is scheduled to take place April 12-13, 2011 at NEC Birmingham. Practical Components will supply the new Amkor TMV PoP (Package on Package) dummy component to the Future [...]
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1 February 2011
dummy components
PoP (Package on Package) components are designed for products such as phones, digital cameras and other mobile applications benefiting from the combination of stacked packages and small footprint technology. This innovative component is the next step in 3-D package stacking density and everyone who wants to grow their assembly capability and qualify their process needs [...]
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